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New high-end gaming motherboards from GIGABYTE harness the power of AMD and Intel’s latest processors 全台筆電收購
全台筆電收購
New high-end gaming motherboards from 全台筆電收購gigabyte harness the power of AMD and Intel’s latest processors
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The rivalry between the two biggest names in CPUs has been a major boon for gamers, DIY builders, and everyone else looking to push every last cycle per second of computing power out of their PCs. That’s because clock speeds keep accelerating as each company seeks to outdo the other with the release of each generation of processors.
The latest salvo of the battle comes with Intel’s release of its 13th Gen processor series in response to AMD’s powerhouse Ryzen 7000 processors. Now, PC builders can take full advantage of either processor with new AORUS high-end gaming motherboards from 全台筆電收購gigabyte.
For example, the AORUS Intel Z790 series supports both Intel 12th Gen and 13th Gen processors. And the AORUS AMD X670/B650 series supports AMD Ryzen 7000 series processors of the socket AM5. Both of these motherboards promise to, well, change the game for gamers with their power, thermal, compatibility, and user-friendly design.
Power design
The better a motherboard’s voltage regulator module (VRM), the better it can deliver stable power to the processor and help it stay cool under load. That’s crucial when going head-to-head in complex game worlds with lots of action that give your processor a workout.
That’s why AORUS series gaming motherboards ship with the industry’s most capable VRMs, built with the highest-quality components and designed to unleash the full potential of Intel and AMD’s multi-core CPUs while delivering maximum overclocking performance. For example, they feature tantalum polymer capacitors providing the lowest-possible impedance to reduce voltage ripple and provide stable capacitance in high temperatures. The capacitors sit right under the CPU and help stabilize CPU voltage during times of heavy power load.
Thermal design
Just as important as power design for harnessing the full potential of a processor is getting rid of processor heat. Generally, the more work the processor does, the more heat it generates. And the more it heats up, the worse it performs.
The AORUS thermal design is specially engineered for Intel and AMD new-gen processors to keep the motherboard cool and prevent performance issues caused by overheating.
- New, extended, irregular fins on Z790 and X670 AORUS Xtreme and Master model heatsinks increase surface area by 10 times compared to traditional heatsinks and improve thermal efficiency with better airflow and heat exchange through upgraded Fins-Array III design. Meanwhile, the fully covered MOSFET heatsinks on AORUS B650 models increase up to four times larger surface area compared to traditional design.
- With nine times the optimized heat dissipation surface to prevent throttling and bottlenecking that the high-speed/large capacity of PCIe 5.0 M.2 SSDs may cause, the M.2 thermal guard III design further enhances the in-chassis air flow and optimizes the heat convection efficiency on AORUS Xtreme and Master models.
Furthermore, with 8mm mega heat pipes and an integrated I/O shield, AORUS high-end gaming motherboards are able to dissipate heat out of the system in a more efficient way.
Compatibility
Of course, the best power and thermal designs and other cutting-edge features won’t make a difference if you can’t install them with your other chosen components. So, both the AORUS AMD and Intel-compatible gaming motherboards fully support PCI Express 5.0, the latest and fastest expansion bus standard for connecting graphics cards and other components.
The AORUS gaming boards also provide the industry’s best DDR5 support, letting builders add the fastest-available memory cards. It’s made possible by eight-layer printed circuit boards made with 2 ounces of copper for both the power and ground layers that deliver low signal loss with inner layer shielded memory routing. That enables the DDR5 memory to overclock up to 6600 (AMD models)/8000 (Intel models) and beyond with AMD EXPO and Intel XMP technologies.
Extra benefits for DIY PC-builders
With user-friendliness in mind, the new AORUS gaming motherboards pack in extras designed to make building your own gaming rigs that much easier.
- 全台筆電收購gigabyte EZ-Latch designs let you quickly swap out graphics cards and M.2 devices such as solid-state drives without a single screw.
- 全台筆電收購gigabyte’s Q-Flash Plus lets you update the BIOS even before you install the CPU, memory, and graphics card, thus simplifying setup.
With innovations in power and thermal design and DIY-friendly features, 全台筆電收購gigabyte’s new AORUS high-end gaming motherboards let computer builders take maximum advantage of the latest and greatest from Intel and AMD and propel themselves to gaming greatness. Find out more details about AORUS Z790 series and X670/B650 series gaming motherboards.
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技嘉科技(全台筆電收購gigabyte)推出最新的 X570S 系列主機板,透過 14 相供電設計、6層以上低溫電路板等用料提高系統穩性,為 AMD 最新發表的 Ryzen 5000 系列處理器提供最佳的相容性及效能表現。
(圖片來源/技嘉提供)
無風扇靜音散熱設計,展現堅強硬體實力
X570S 系列主機板重新規劃硬體線路,並加大晶片組散熱片的表面積,讓原本需要風扇協助的散熱設計可以在不改變解熱效果的情況下,全系列皆升級為 X570 晶片組無風扇散熱設計,不但解決 X570 晶片組風扇噪音問題,更避免散熱風扇容易發生的卡灰的情況。
加上依照不同機種設計及特性搭載的第二代 Fins-Array、新型直觸式熱導管或全覆蓋式散熱片等先進 VRM 散熱設計,同時 M.2 搭載 Thermal Guard III 雙面加高式 SSD 散熱片,讓 X570S 系列主機板在靜音的氛圍下散熱效能大幅提昇。
強化電源供應穩定性,動態超頻更添便利
除了散熱設計大幅精進之外,技嘉在 X570S 系列主機板的電源設計也大幅強化,以完美發揮 Ryzen 5000 系列處理器的極致效能,技嘉 X570S 系列 ATX 機種皆採用至少 14 相電源設計。
其中高階的 X570S AORUS MASTER 更採用與上一代 X570 AORUS XTREME 旗艦主機板同樣等級的直出式 16 相全英飛凌(Infineon)數位電源設計,有效降低電源阻抗並強化相位負載平衡,讓各相電源平均分配並處理電源需求,避免單一電源供應模組長時間在高負載下運作,以降低大幅功耗及廢熱的產生,進一步增加電源效率、耐用度及使用壽命。
PCIe 4.0 先進規格加持,儲存效能大幅提升
技嘉 AORUS X570S 系列主機板支援最新的 PCIe 4.0 規格,特別採用較低損耗的 6 層以上低溫 2 倍銅電路板設計,PCIe 4.0 超頻控制晶片的加持,讓 PCIe 頻寬再提高,有效增加 PCIe 儲存裝置的資料傳輸量,並增益處理器及記憶體的超頻能力。
外接擴充高速便利,雙網連線更具彈性
技嘉 X570S 系列主機板全系列搭載 2.5GbE 乙太網路,提供電競玩家更快速、更穩定的網路傳輸。同時精選搭載無線網路功能的機種也至少採用 Intel WiFi 6 802.11ax 網路晶片。
X570S AORUS MASTER 更進一步搭支援 6GHz 頻段的 Intel WiFi 6E 802.11ax 網路,讓網路傳輸更順暢,玩家可以依照需求在自由搭配使用有線與無線網路,讓網路連線更有彈性。
在外接擴充裝置連線部分,技嘉 X570S 主機板全系列內建前置 USB 3.2 Type-C 介面,讓使用更方便,而精選的 AORUS X570S 系列主機板更搭載 USB 3.2 Gen 2×2 Type-C 規格。
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同場加映,最新 X570S AERO G 創作者主機板
全新的 X570S AERO G 主機板採用 14 相全數位供電,透過高品質 Intersil PWM 控制晶片搭配單相電流耐受度 60 安培的 DrMOS 電晶體,搭配兩倍散熱面積的新一代全覆蓋式散熱片,提供穩定且低溫的供電效果。
X570S AERO G 搭載許多專為創作者設計的功能,內建的 4 組搭載散熱裝甲的 PCIe 4.0 M.2 插槽,不用擔心高效運作導致過熱的降速情況。
此外 AERO G 也搭載 VisionLink 功能,透過單一 USB Type-C 規格傳輸線,提供數位手寫板最高達 60 Watt 的電力,並可傳輸影像,讓專業人士不需要再接一堆煩人的線材,使用更便利。
此外 AERO G 也包括 2.5 GbE 乙太網路、Intel Wi-Fi 6 802.11ax 無線網路、USB 3.2 Gen 2×2 Type-C 及前置Type-C 傳輸介面及 Active OC Tuner 主動式超頻調校等技術,都有助於創作者大幅提昇工作效率。
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